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This is a "connection" page, showing publications co-authored by Alfred Crosby and Ryan Hayward.
Alfred Crosby
Connection Strength
0.654
Ryan Hayward
  1. Thomas EM, McBride MK, Lee OA, Hayward RC, Crosby AJ. Predicting the Electrical, Mechanical, and Geometric Contributions to Soft Electroadhesives through Fracture Mechanics. ACS Appl Mater Interfaces. 2023 Jun 28; 15(25):30956-30963.
    View in: PubMed
    Score: 0.226
  2. Thomas EM, Fu H, Hayward RC, Crosby AJ. Geometry-controlled instabilities for soft-soft adhesive interfaces. Soft Matter. 2022 Nov 02; 18(42):8098-8105.
    View in: PubMed
    Score: 0.216
  3. Kim HJ, Paquin L, Barney CW, So S, Chen B, Suo Z, Crosby AJ, Hayward RC. Low-Voltage Reversible Electroadhesion of Ionoelastomer Junctions. Adv Mater. 2020 Jun; 32(25):e2000600.
    View in: PubMed
    Score: 0.182
  4. Lee CH, Crosby AJ, Hayward RC, Emrick T. Patterning nanoparticles into rings by "2-D Pickering emulsions". ACS Appl Mater Interfaces. 2014 Apr 09; 6(7):4850-5.
    View in: PubMed
    Score: 0.030
Connection Strength

The connection strength for concepts is the sum of the scores for each matching publication.

Publication scores are based on many factors, including how long ago they were written and whether the person is a first or senior author.