Paul Kirby to Electroplating
This is a "connection" page, showing publications Paul Kirby has written about Electroplating.
Connection Strength
0.023
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Dou G, Holmes AS, Yeatman EM, Wright RV, Kirby PB, Yin C. Transfer of functional ceramic thin films using a thermal release process. Adv Mater. 2011 Mar 11; 23(10):1252-6.
Score: 0.023